Whether the standard, warpage or edge contact process is used, our Wafer Aligner HPAs reliably align wafers with a diameter of 2 inches up to 12 inches. These units are expanding our product range as our first standard motion solution for wafer handling in semiconductor production.

Equipped with a high-quality laser sensor, the wafer aligner supports in the alignment of transparent, translucent and opaque wafers. In just a few seconds, three of our axes with spindle drive centre wafers and align the angles with precision of ±0.1 mm and angular accuracy of ±0.2°. Depending on the aligner model, an X-Y unit or an X-Z unit is used. With its all-in-one design, the HPA series is extremely compact, which also makes it suitable for integration into demanding system concepts. We also score points when it comes to the extremely short delivery times of the new wafer aligners. Ideal for applications in the semiconductor industry, the Wafer Aligner of the HPA series is also suitable for clean room class 3 thanks to its ISO certification (ISO 14644-1).

You too can use the reliable wafer aligners for your wafer handling process and take advantage from our short delivery times and quick response times. Additional information on the new Wafer Aligner HPA can be found here.