Multiple motion

Linear axes and axis systems are used in many ranges of industry to transport or position components. HIWIN offers linear axes with toothed belt drive for applications with high dynamics and speed. Thanks to HIWIN's modular system, the belt axes can be bendably combined into double axes and multi-axis systems depending on requirements. HIWIN linear axes with ballscrews are available for applications that require high feed forces and precision. HIWIN linear axes with linear motor drive fulfil the highest requirements in terms of dynamics, precision and synchronisation.

Our precision axes and precision systems are labelled with the highest degree of precision. Repeat accuracies of ±0.05 um are achieved with high-resolution displacement measurement. This high precision makes our systems suitable for applications in the semiconductor industry as well as in medical and measurement technology. Standardised types are available, which we can customise to your requirements on a modular basis. The advantages: reduced development times, fast quotations and short delivery times.

The Wafer Aligner HPA reliably aligns transparent, translucent and opaque wafers. Whether the standard, warpage or edge contact process is used, the new models align wafers with a diameter of 2 inches up to 12 inches in just a few seconds. Three moving HIWIN axes with spindle drive are used here for wafer centring and angular alignment. Depending on the aligner model, an X-Y unit or an X-Z unit is used. Due to its compact design, the HPA series is also ideal for integration into demanding system concepts. Ideal for applications in the semiconductor industry, the Wafer Aligner of the HPA series is suitable for clean room class ISO 3.